sysmoEUICC1 eUICC for consumer eSIM RSP
€23.80*
The sysmoEUICC1-C2x is an eUICC for use within the consumer eSIM systemThe eUICC (embedded Universal Integrated Chip Card) is the hardware component typically soldered onto the circuit board of a
UE (User Equipment, the term 3GPP uses for a phone/modem). It is the physical component onto which the purely logical/virtual
eSIM [profiles] are installed.The sysmoEUICC-C2x is packaged in the traditional plastic card form factor of SIM/UICC cards. It is a so-called seamless cut,
allowing for a single card to be used in full (credit card) size, as well as 2FF (mini-SIM), 3FF (micro-SIM) or 4FF (nano-SIM). This form-factor is useful primarily in that: it can be used to eSIM-enable devices that have a traditional SIM card slot, and no built-in/on-board eUICCit can be used during research, development and testing; for example by inserting it into a smart-card reader that is attached to
a computerFor more details, please see the product user manual.Overview of Variants
VariantSystemForm-FactorCertificates
sysmoEUICC1-C2GConsumer2FF/3FF/4FFGSMA
sysmoEUICC1-C2TConsumer2FF/3FF/4FFSGP.26 Test
sysmoEUICC1 eUICC for consumer eSIM RSP no ARA-M
€35.70*
THIS IS A VARIANT of sysmoEUICC1-C2G WITHOUT PRE-INSTALLED ARA-M APPLET IN ISD-R.The sysmoEUICC1-C2G is an eUICC for use within the consumer eSIM system.The eUICC (embedded Universal Integrated Chip Card) is the hardware component typically soldered onto the circuit board of a
UE (User Equipment, the term 3GPP uses for a phone/modem). It is the physical component onto which the purely logical/virtual
eSIM [profiles] are installed.The sysmoEUICC-C2G is packaged in the traditional plastic card form factor of SIM/UICC cards. It is a so-called seamless cut,
allowing for a single card to be used in full (credit card) size, as well as 2FF (mini-SIM), 3FF (micro-SIM) or 4FF (nano-SIM). This form-factor is useful primarily in that: it can be used to eSIM-enable devices that have a traditional SIM card slot, and no built-in/on-board eUICCit
can be used during research, development and testing; for example by
inserting it into a smart-card reader that is attached to
a computerFor more details, please see the product user manual.THIS IS A VARIANT of sysmoEUICC1-C2G WITHOUT PRE-INSTALLED ARA-M APPLET IN ISD-R.
sysmoEUICC1 eUICC for consumer eSIM RSP in MFF2 (10-pack)
€297.50*
The sysmoEUICC1-CMx is a solder-type eUICC for use within the consumer eSIM system.This product is a 10-pack, containing 10 units as MFF2 chips on cut tapeThe eUICC (embedded Universal Integrated Chip Card) is the hardware component typically soldered onto the circuit board of a
UE (User Equipment, the term 3GPP uses for a phone/modem). It is the physical component onto which the purely logical/virtual
eSIM [profiles] are installed.The sysmoEUICC-CMx is packaged in the ETSI MFF2 form-factor for soldering.For more details, please see the product user manual.Note that the pricing reflects the "sample quantity" nature of this product in the webshop. For bulk volume orders, significant discounts apply. Please reach out to sales@sysmocom.de if you'd like to order bulk volumes of this productOverview of Variants
VariantSystemForm-FactorCertificates
sysmoEUICC1-CMGConsumerMFF2GSMA
sysmoEUICC1-CMTConsumerMFF2SGP.26 Test