sysmoEUICC1 eUICC for consumer eSIM RSP in MFF2 (10-pack)

€297.50*

Prices incl. VAT plus shipping costs

eUICC Certificates / Keys

GSMA

SGP.26 Test

Product number: sysmoEUICC1-CMG-10p

Product information "sysmoEUICC1 eUICC for consumer eSIM RSP in MFF2 (10-pack)"

The sysmoEUICC1-CMx is a solder-type eUICC for use within the consumer eSIM system.

This product is a 10-pack, containing 10 units as MFF2 chips on cut tape

The eUICC (embedded Universal Integrated Chip Card) is the hardware component typically soldered onto the circuit board of a UE (User Equipment, the term 3GPP uses for a phone/modem). It is the physical component onto which the purely logical/virtual eSIM [profiles] are installed.

The sysmoEUICC-CMx is packaged in the ETSI MFF2 form-factor for soldering.

For more details, please see the product user manual.

Note that the pricing reflects the "sample quantity" nature of this product in the webshop. For bulk volume orders, significant discounts apply. Please reach out to sales@sysmocom.de if you'd like to order bulk volumes of this product

Overview of Variants

Variant	System	Form-Factor	Certificates
sysmoEUICC1-CMG	Consumer	MFF2	GSMA
sysmoEUICC1-CMT	Consumer	MFF2	SGP.26 Test

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